Whether you need mechanical sawing, Ion implantation, or die singulation, we have you covered. Our team will get your project done right – fast. Below is a brief overview of these wafer dicing services. We also offer other services, such as wafer cutting and die singulation.
Integrated device manufacturers need the best ion implantation services to improve the performance of their wafer dicing equipment and to minimize the cost of ownership. II-VI offers refurbishment services for both disks and heat sinks. Refurbishment services include qualification, installation, process testing, scheduled and unscheduled maintenance, and end-of-life determination. A variety of ion implanter models are supported.
The ion beam can be implanted into targets for the purpose of creating a new crystallographic phase underneath the host crystal. It can also be implanted on the surface of a substrate, which produces a layer with a crystallographically matching phase. This process can also result in alloying the surface, making it corrosion-resistant, or strengthening adhesion between layers.
The cost of laser ablation for wafer dicing is a significant consideration when deciding which dicing process to use. The cost per die depends on the number of die required, the time it takes to dice the wafer, and the yield of the system. The most cost-effective solution is blade dicing, which has been around for decades. Spare parts and used systems are readily available. The next best options are laser ablation and Stealth Dicing(r) processes. However, the cost of plasma solutions requires the highest initial capital expenditure, particularly if you are planning a large-volume program.
Although laser ablation has many benefits, one of the biggest challenges is the removal of material from the kerf. When dicing a wafer, a 20um kerf is roughly equivalent to the gap between two three-story buildings. That’s almost as big a gap as one can throw a ball through! However, some lasers can remove material from the kerf without causing damage to the underlying layers.
One of the most important aspects of stealth dicing is the ability to avoid the impact of a shock on the active surface. The shock is diverted under the surface, where it is absorbed by a line of pulses that create a crack plane leading to die separation. The closer the line is to the active surface, the less impulse energy is used, while the further it is beneath the surface, the less energy is required. In addition, the stealth dicing process produces almost no heat and no debris.
Another feature of stealth dicing is the elimination of waste from the process. It is a zero-waste process, and unlike laser ablation, there is no need to clean and sterilize the dies. It can be applied to many different materials, including multi-project-wafers, MEMS, and various materials. Stealth dicing is a two-stage process that produces very small perforations in the SD layer.
Tape dicing services for wafer manufacture are available in various forms to meet the needs of customers. These services include manual dicing, automated die sorting, and tape dicing. They can also dice waffles, gel packages, and individual dies. In addition, these services can also dice bumped wafers or portions of them. Many of these services also allow for high-temperature dicing of various materials.
There are two types of tape dicing services available: UV Dicing tape and non-UV tape. Both have different properties. The former offers a higher adhesion strength, while the latter can be easily removed. The non-UV tape’s backing is made of non-halogen materials and is expandable. Both types of tape dicing are available for a wide range of applications, including ICs, LTCC substrates, Si wafers, glass, ceramics, and more.
Traditional blade dicing
Dicing processes are designed to create almost perfect edges, and are especially helpful when a material is extremely hard and brittle. These processes allow higher cutting speeds while maintaining the self-sharpening mechanism of dicing blades. While the dicing process may produce slightly inferior edges, this process is the most cost-effective way to process thin wafers. This article will discuss some of the benefits of blade dicing for wafers.
Dicing blades are made for cutting a wide variety of materials, including glass on silicon. You may want to consult with the manufacturer of your dicing machine to find out what kinds of blades are available for other cutting applications. Dicing blade thickness will depend on the material being cut and the exposure of the blade. For example, thin glass may require a thin blade with a high-speed spindle.